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Event

FuelScan: Portable LIBS for trace metals in fuels

Richard Wainner, Nicholas Aubut, Kristin Galbally-Kinney, Shin-Juh Chen, Mickey Frish, and David Gamliel
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22 April 2024 • 3:40 PM – 4:00 PM EDT

Leak detection tools for the decarbonization and demethanization infrastructure

Nicholas F. Aubut, Shin-Juh Chen, Michael B. Frish, and Roy W. Massengale
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23 April 2024 • 11:30 AM – 11:50 AM EDT

Event

Event

Multi-Platform Methane Leak Detection Solutions for Natural Gas Infrastructure

Authors: Shin-Juh Chen (Presenter), Michael B. Frish, Nicholas F. Aubut, and Richard T. Wainner
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May 13 – 16th 2024 • TBD

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Flexible Thermal Protection Systems

Dr. Rachel Guarriello
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Tuesday, January 23, 2024 • 10:20 AM

Rapid Manufacture of Affordable Robust Composite Structures

Mr. Thomas Fusco
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Wednesday, January 24, 2024 • 10:20 AM

Insitu Mechanical Strength Testing of Composite Materials Subjected to a Simulated Hypersonic Environment in a Laboratory Testbed

Dr. David Oakes
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Wednesday, January 24, 2024 • 1:40 PM

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Event

Phase imaging in the living eye

Mircea Mujat, Ankit H. Patel, Nicusor Iftimia
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29 January 2024 • 5:30 PM – 7:00 PM PST | Moscone Center, Room 2003 (Level 2 West)

Multispectral cellular-level imaging of Aβ in the retina

Mircea Mujat, Ankit Patel, John Grimble, Nicusor Iftimia
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27 January 2024 • 1:30 PM – 1:45 PM PST | Moscone Center, Room 156 (Upper Mezzanine South)

Simultaneous OCT enables interpretation of dark-field SLO images in diseased eyes

Mircea Mujat, Konstantina Sampani, Ankit Patel, Jennifer K. Sun, Nicusor Iftimia
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28 January 2024 • 5:30 PM – 7:00 PM PST | Moscone Center, Room 2003 (Level 2 West)

High-resolution retinal phase gradient imaging using line-scanning laser ophthalmoscopy

Ankit Patel, Mircea Mujat, Nicusor Iftimia, Taeyoon Son, Tobiloba Adejumo, Xincheng Yao
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27 January 2024 • 2:30 PM – 2:45 PM PST | Moscone Center, Room 156 (Upper Mezzanine South)

Smart sensor for guiding safe delivery of anesthetic and pain drugs through epidurals

Ge Zhu, John Grimble, Gopi Maguluri, Nicusor Iftimia
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31 January 2024 • 3:00 PM – 3:20 PM PST | Moscone Center, Room 201 (Level 2 South)

Press Release

Press Release

Physical Sciences Inc. (PSI) has been awarded a contract from the U.S. Navy to develop a method for hermetically sealing MEMS devices with matched coefficient of thermal expansion materials.

Within this program, to improve the lifetime of microelectromechanical systems (MEMS), Physical Sciences Inc. (PSI) will develop a method for hermetically sealing two silicon wafers with at least one of the wafers having a surface roughness that prevents direct bonding. While current methods exist to bond the wafers together they involve addition of materials whose coefficients of thermal expansion (CTE) are mismatched with that of silicon. Stress associated with differential expansion or contraction due a large temperature change for a long duration could lead to a plastic strain (creep). It is, therefore, inadvisable to insert materials between the silicon wafers with a material that does not have a very similar CTE to that of silicon and to insert as little as possible to achieve hermetic sealing. PSI proposes a technique that will accomplish the task of hermetic sealing and retain minimal or zero distortion due to mismatched CTEs.

For more information, contact:

Dr. Christopher Evans
Group Leader, Scalable Photonic Technologies
cevans@psicorp.com
Physical Sciences Inc.
Office: (978) 689-0003

Acknowledgement of Sponsorship: This work is supported under a contract with the Naval Surface Warfare Center. This support does not constitute an express or implied endorsement on the part of the Government.

Press Release

Press Release

Physical Sciences, Inc. (PSI) has been awarded a contract from the U.S. Navy to develop an integrated on-chip optical isolator that provides an isolation contrast greater than 30dB and low optical insertion loss in the thin-film lithium niobate platform.

Laser systems are ubiquitous in high-data rate communication and sensor systems in which unwanted back-reflections from optical components can cause instabilities in the laser spectrum leading to poor system performance or damage to the laser itself. As photonic technologies miniaturize with advancements in photonic integrated circuit (PIC) technology, the development of on-chip optical isolators are of critical importance. To address these issues Physical Sciences Inc. (PSI) will develop an Acoustically driven Near-infrared on-Chip Optical Isolator for photonic Circuits (ANECHOIC) to achieve high optical isolation contrast (IC) in a compact footprint that is able to be incorporated easily into (PIC)-based systems for ultra-sensitive applications in thin-film lithium niobate (TFLN).

For more information, contact:

Dr. Christopher Evans
Group Leader, Scalable Photonic Technologies
cevans@psicorp.com
Physical Sciences Inc.
Office: (978) 689-0003

Acknowledgement of Sponsorship: This work is supported under a contract with the Naval Surface Warfare Center. This support does not constitute an express or implied endorsement on the part of the Government.