We use a virtual foundry model, including a trusted vendor supply chain, to fabricate PICs in material systems such as Silicon
- Silicon Nitride
- Thin-Film Lithium Niobate (TFLN)
- Indium Phosphide
Where existing solutions are already optical, these optical circuits bring Size, Weight, Power, and Cost (SWaP-C) reduction. Where the existing solution is only electronic, these PICs enable new capabilities in application areas such as:
- Photonics, Antenna Remoting
- Q-bit multiplexing (time, frequency, etc.)
- Beam conditioning and delivery for quantum sensors and free space
- Chip-based Spectrometer
- Optical Phased Array